RESPONSIBILITIES: 1. Be responsible for the failure analysis of digital related failure, including but not limited to electrical failure analysis (EFA) and physical failure analysis (PFA). 主要负责芯片数字部分的失效分析工作。包括电学失效定位与物理层面失效机理定位。 2. Develop digital related function failure analysis plans, use various advanced analysis tools and techniques to analyze failed samples. 制定数字芯片失效分析方案，运用各种FA工具和技术对失效样品进行分析。 3. Work closely with design, technology development and test department collaboratively to solve the failure problems that occur during the R