Summary:
- Package design for Manufacture.
- Package level and SMT level stencil design.
- Provide package total solution; include but not limited to Stack up discussion, layout, stencil design, timeline tracking and handle the package relevant qualification.
RESPONSIBILITIES:
- Package design for Manufacture.
- Need work with assembly house, SMT site, material vendor, to develop and qualify the new materials and new package processes.
- Coordinate with the internal team to identify the module package related issues, give DFM report/ suggestions for new packages, address the root cause and find the solution.
- Sum up the experience of package design manufacture issue, SMT process and maintain the design rule.
- Review the packaging drawings and assure them to meet package design rules, including package outline, build kit, lead frame drawing, bump mask drawing, etc.;
- Tracking new package project timeline and response to internal team.
- Perform other tasks assigned by superiors.
REQUIREMENTS:
1. Good knowledge of package design, knowledge of design for manufacturing.
2. Hands-on experience on PCB design in SMT or PCB factory.
3. Proficient Cadence software, CAD.
4. Bachelor’s degree with 8 years related experience.